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Assembly System
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Sip Bonder DB-700
 
DB-700

High speed and High accuracy flexible Die Bonder for SiP (System in Package) with 300mm wafer handling capability.

  • World's smallest class of die bonder for 300mm wafer
    (Reducing size, light weight and low vibration design)
  • High UPH is realized by new bonding head mechanism
  • Response to stacked package production with multiple connection
 
 

CSP/LOC Mounter CM-700
 
CM-700

High speed, High accuracy and Conpact CSP/LOC Bonder for 300mm Wafer.

  • High speed bonding (up to 3000UPH)
  • Small foot print. (x 0.77 CM-300)
  • Applicable for BOC, micro BGA and LOC packages
  • Applicable for 300mm and 200mm wafers
 
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