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Sip Bonder DB-700 |
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High speed and High accuracy flexible Die Bonder for SiP (System in Package) with 300mm wafer handling capability.
- World's smallest class of die bonder for 300mm wafer
(Reducing size, light weight and low vibration design)
- High UPH is realized by new bonding head mechanism
- Response to stacked package production with multiple connection
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CSP/LOC Mounter CM-700 |

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