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Wafer Gold Bump 2D&3D Inspection System WB3100

WB3100

The best solution for COG Au wafer Bump Inspection with high speed all Bump measurment.

Inspection Item : Au Straight Bump Defect
- Low Bump, Crater, Projection, Position, Missing Bump,
Particles etc.
- 22 Fine pitch Bump Inspection.
Wafer size :
- 150mm and 200mm. (125mm is Option)
- 300mm is available.
Wafer Handling :
- Automatic cassette to cassette handling.
- FOUP stand for 300mm wafer.

Wafer Solder Bump 2D&3D Inspection System WB3200

WB3200

The best solution for Solder or Fb-Free Bump Inspection with high speed all Bump measurment.

Inspection Item : Solder Ball Bump Defect
- Ball size, Ball position, Particles, Nodule, Bridge, Missing,
Hollow, etc.
- Ball height and width measurment.
Wafer Size :
- 150mm and 200mm (125mm is Option)
- 200mm and 300mm
Wafer Handling
- Automatic cassette to cassette handling.
- FOUP stand for 300mm wafer.

Sip Bonder DB-700

DB-700

High speed and High accuracy flexible Die Bonder for SiP (System in Package) with 300mm wafer handling capability.

World's smallest class of die bonder for 300mm wafer
(Reducing size, light weight and low vibration design)
High UPH is realized by new bonding head mechanism
Response to stacked package production with multiple connection

CSP/LOC Mounter CM-700

CM-700

High speed, High accuracy and Conpact CSP/LOC Bonder for 300mm Wafer.

High speed bonding (up to 3000UPH)
Small foot print. (x 0.77 CM-300)
Applicable for BOC, BGA and LOC packages
Applicable for 300mm and 200mm wafers

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