Skip to header Hitachi High-Technologies
 News & Event       Sitemap

 Go HITACHI Top
global navigation start   | Home | About Us | Investor Relations | Global Network |  Products & Service | Customer Service |


page title

SiP Bonder DB800HSD
starting of main content
 
 
SiP Bonder DB800HSD Further advanced high speed & high accuracy flexible die bonder which is for SiP packaging by 300mm wafer

 

Features

High productivity realizes for DAF process & Paste process


Multi Stacked Package Solution

  • Vision system for positioning correction
  • Reducing particles for stacked packaging by clean system
ending of main content
Search by Google

 > Advanced Search
starting of secondary navigation
Semiconductor Manufacturing Equipment

Dry Etch System

Metrology & Inspectio

Assembly & Surface Mount Systems

Flexible Die Bonder DB900

SiP Bonder DB800HSD

Multi Chip Bonder MC4

Solder Die Bnder SHD Series(SHD-300/350/400/450)

Flip Chip Bonder FC-NEXT

Plasma Cleaning System SPC Series(SPC-100/500B)

Contact Us
ending of secondary navigation
page top
starting of footer  | Terms of use | Privacy Policy | All Rights Reserved. Copyright (C) 2001, 2012. Hitachi High-Technologies Corporation.