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Flexible Die Bonder DB900
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Flexible Die Bonder DB900 150-300mm wafer supply for small package High speed & intelligent die bonder by linear motor driving

 

Features

High productivity

  • New development bonding head & indexing system by linear motor

Wide Response from Paste Products to DAF Products


Standard Wafer Size is 150-200mm, and 300mm by Option


Small Footprint Design (82% from DB800 Series)

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Semiconductor Manufacturing Equipment

Dry Etch System

Metrology & Inspectio

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Flexible Die Bonder DB900

SiP Bonder DB800HSD

Multi Chip Bonder MC4

Solder Die Bnder SHD Series(SHD-300/350/400/450)

Flip Chip Bonder FC-NEXT

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