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Flip Chip Bonder FC-NEXT
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Flip Chip Bonder FC-NEXT New generation multi-heads type flip chip bonder to realeze hightest productivity on high placement accuracy

 

Features

Realize highest productivity on high placement accuracy


Interconnect process : Solder Bump (C4), Cu post + solder (C2)


High speed recognition (4 die can be recognized from the back angle at the same time)


Large size substrate application

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Semiconductor Manufacturing Equipment

Dry Etch System

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Flexible Die Bonder DB900

SiP Bonder DB800HSD

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Solder Die Bnder SHD Series(SHD-300/350/400/450)

Flip Chip Bonder FC-NEXT

Plasma Cleaning System SPC Series(SPC-100/500B)

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