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Plasma Cleaning System SPC Series(SPC-100/500B)
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Plasma Cleaning System SPC Series(SPC-100)
Plasma Cleaning System SPC Series(SPC-500B)

The plasma cleaning system improves the bonding strength for wire bonding,the bonding strength for flip chip bonding, the filling capability for underfilling and the adhesiveness for resin sealing
 

Features

Multi-product production to Mass production


Two kinds of plasma mode

  • RIE(Reactive Ion Etching) ⇔ PE(Plasma Etching)

High uniformity


High density & Large area processing


For 12inch wafer and large sized substrate

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Semiconductor Manufacturing Equipment

Dry Etch System

Metrology & Inspectio

Assembly & Surface Mount Systems

Flexible Die Bonder DB900

SiP Bonder DB800HSD

Multi Chip Bonder MC4

Solder Die Bnder SHD Series(SHD-300/350/400/450)

Flip Chip Bonder FC-NEXT

Plasma Cleaning System SPC Series(SPC-100/500B)

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