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Dry Etching System

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UHF-ECR Plasma Etch System U-8150

 
U-8150

New 300mm UHF-ECR Plasma Etch System.

  • New Silicon Etch System for improved WtW and WiW CD control targeting the 45 and 32nm tecnology nodes.
  • Improved design resulting in increased productivity and yield compared to U-7000 system.
     
     -  Yield Enhancements
    Symmetrical exhaust camber / New material chamber / Multi-waves monitor / Advanced temperature controlled electrode
     -  Productivity Enhancements
    High speed and low particle transfer system / Replaceable process chamber
     
  • Multi-Chamber Platform.
    4 etch chambers available
  • APC Capability(Option)
 
 

UHF-ECR Plasma Etch System U-8250

 
U-8250

New 300mm UHF-ECR Plasma Etch System.

  • New Dielectric Etch system with enhanced process window and new plasma source design.
  • Improved WtW and WiW CD control targeting the 45 and 32nm tecnology nodes.
  • Improved design resulting in increased productivity and yield.
     
     -  Yield Enhancements
    New material chamber / Multi-waves monitor / Advanced temperature controlled electrode
     -  Productivity Enhancements
    ECP* chamber / High speed in-situ cleaning / High speed and reduced defect density
     
  • Multi-Chamber Platform.
    4 etch chambers available
  • APC Capability(Option)
  • * ECP : Electrically Confinement Plasma
     
 
 

UHF-ECR Plasma Etch System U-600/7000 Series

 
U-600/7000 Series

200mm / 300mm UHF-ECR Plasma Etch System for Gate,Metal and Dielectric film stacks.

  • Excellent WtW and WiW CD control targeting the 65nm technology node.
    Superior Chamber design resulting in uniform gas distribution and by-product control.
  • High selectivity etching with low deposition and superior profile control.
  • APC Capability(Option)
 
 

Microwave Plasma Etch System M-7000 Si Etch System

 
M-7000

Industry Leading Reliability and Uniformily for the 45nm Technology Node.

  • New Chamber design enhanced process window and provides productivity improvements.
  • High Density Plasma source provides world class WtW and WiW CD control targeting the 45 and 32nm technology nodes.
  • Improved design resulting in increased productivity, lower CoC and reduced defect density.
  • FA/CIM and APC Capability.
  • APC Capability(Option)
 
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