Dry Etch System : Hitachi High-Technologies Corporation

Topics

	05, Mar, 2010	Hitachi High-Tech receives Intel’s prestigious Supplier Continuous Quality Improvement Award for the fifth time in a row.(PDF 472KB)
	22, Feb, 2010	Etch process development for double patterning with self-freezing ArF resist and spin on hard mask.
	03, Dec, 2009	Advanced etch technology presented at the SEMI Technology Symposium.

Lineup

Silicon Etch System

Hitachi High-Tech’s silicon etch system targets not only silicon gate and silicon trench, but new devices including High-k/Metal Gate. Hitachi High-Tech’s silicon etch system provides superior profiles and excellent productivity.

Oxide Etch System

Hitachi High-Tech’s U-8250 is suitable for various etch applications such as high aspect ratio holes, spacer and hard mask. The U-8250 offers higher productivity and excellent uniformity by multiple independent parameter control.

Non-Volatile Material Etch System

Hitachi High-Tech delivers a non-volatile material etch solution for next generation memories and HDD^(*1) thin film heads. The system offers higher productivity for these applications with a unique cleaning technology.
*1 HDD : Hard Disc Drive

Production Support Program

To exceed customer needs, we contribute to the reduction of total cost by providing multiple solutions to improve equipment manufacturing processes and productivity.

* These photographs are partially different from actual systems.