Hitachi High-Tech features EMCP(*1) as an unique solution with integrated cleaning technology for non-volatile material etch. It offers highly productive etch of non-volatile materials used for next generation memories and thin film heads for HDD(*2).
*1 EMCP : Electro Magnetically Coupled Plasma
*2 HDD : Hard Disc Drive
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Non-volatile material etch system |
Next generation memories such as FeRAM(*3) and MRAM(*4) require the etching of novel non-volatile materials. However, adhesive by-products inside of etch chamber causes significant productivity loss in volume production. EMCP offers an outstanding solution to this problem ensuring constant high performance even for non-volatile material etch.
*3 FeRAM:Ferroelectric Random Access Memory
*4 MRAM:Magnetoresistive Random Access Memory
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Main features
| Applicable wafer diameter |
150mm,200mm,300mm(under development) |
| System configuration |
2 etch+ 2 ash (max.) |
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Magnetic head etch system |
Rapid increases in aerial densities of HDD requires advanced patterning solutions for thin film head production. This brings leading-edge semiconductor processes into the HDD industry as a breakthrough. The EMCP etch system provides superior performance in profile control as well as in higher etching rate and selectivity compared to conventional ion-milling processes. An optional in-line rinser also enhances anti-corrosive in-line processes.
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Main features
| Applicable wafer diameter |
150mm,200mm |
| System configuration |
1 etch + 1 ash |
| Option |
In-line rinser |
* These figures are drawn by CG, and partially different from actual systems.
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