Inspection

Defect Review SEM supports High Yield in 45 nm generation and beyond.
It is an automated in-line Defect Review SEM and ideal for improving yield and achieving faster ramp-ups toward high volume semiconductor device manufacturing operations.
RS-5000 series has superior image quality and contrast, high throughput ADR (Automatic Defect Review) and high accuracy ADC (Automatic Defect Classification). ADR for unpatterned wafers, process monitoring and Intelligent Sampling are available as optional functions.

High speed and high sensitivity EB wafer inspection system for 45 nm and beyond.
New electron optics and advanced image processing system have realized high speed and high sensitivity inspection as well as excellent measurement repeatability with enhanced VC (Voltage Contrast).
Real-time Automatic Defect Classification function is also available.

LS6800 are capable of detecting smaller than 40 nm defects on unpatterned wafers with high sensitivity and throughput. Those tools support yield enhancement through high precision discrimination and detection of COP defects, particles, CMP scratches and particles.

Delivering High Detection Sensitivity and High Inspection Throughput Enabling Yield Improvement and Production Cost Reduction.