Ion Milling System IM4000 : Hitachi High-Technologies Corporation

	Hybrid Instrument With Cross-section milling and Flatmilling !

Features

Hybrid model : Two milling configurations available

Cross-section milling : smooth polishing of cross-section specimens for high resolution imaging of subsurface structures.

Flatmilling : uniform polishing of surfaces as large as 5 mm with variable angle milling to selectively enhance specimen surface features.
Higher Throughput : Improved milling efficiency

Reduced cross-sectioning times with new ion gun design compared to previous E-3500 model. (Max.Milling rate: 300 µm/h for Si - 66% reduction in processing time)
Removable sample stage unit :

Removable sample stage unit for convenient specimen setting and cutting edge definition.

Specifications

Items	Description
Items	Cross-section milling holder	Flatmilling holder
Gas used	Ar (argon) gas
Accelerating voltage	0 to 6 kV
Maximum milling rate^(1)(2)(Materials Si)	Approx. 300 µm/h^(1)(2)	Approx. 20 µm/h^(3) (spot) Approx. 2 µm/h^(4) (flat)
Maximum sample size	20(W)×12(D)×7(H) mm	Φ50×25(H) mm
Sample moving range	X±7 mm, Y 0 to +3 mm	X 0 to +5 mm
Rotation angle	-	1 r/m, 25 r/m
Swing angle	±15°, ±30°, ±40°	±60°, ±90°
Tilt	-	0 - 90°
Gas flow rate control system	Mass flow controller
Evacuation system	Turbo-molecular pump (33 L/s) + Rotary Pump(135 L/min at 50 Hz, 162 L/min at 60 Hz)
Dimension	616(W)×705(D)×312(H) mm
Weight	Main unit 48 kg+Rotary pump 28 kg
Optional Accessories	Optical microscope for viewing of the specimen during milling

^(*1):This rate is the maximum depth obtained when Si is protruded from a mask edge for processing by 100 µm.
^(*2):This rate is the average value obtained when Si is processed for two hours.
^(*3):Illuminating angle : 60° Eccentric value : 4 mm
^(*4):Illuminating angle : 0° Eccentric value : 0 mm