Semiconductors Related Equipments : Hitachi High-Technologies Corporation

Plasma Cleaning System (Plasma Cleaner) "SPC-100 (B+H)"

This plasma cleaning system was developed to improve the bonding strength for wire bonding, the bonding strength for flip chip bonding, the filing capability for underfiling, and the adhesiveness for resin searing.

Multi-product Small-Scale Production to Mass Production (The building block system made it possible to change your device from manual one to automatic one)
Processing time : 12 to 30 seconds/board
High Density and Large Area Processing (RF power source Max.600w, Processing area of 300mm)
Plasma switching of PE and RIE is possible
Plasma Processing in Wafer Level Package Process (4, 5, 6, 8inch Wafer)

Direct Tape and Reel Machine "STP-200A"

This machine picks up the diced chips from wafer flat ring. After flipping, it inserts them into 8mm emboss tape up to 24mm, seals with cover tape and winds them around the reel.
Chip positioning is performed by recognition camera, the damage for chips is lessened.
Also, high-quality and high-reliability taping is possible with chip vision inspection.

Direct taping from wafer flat ring
8mm emboss tape up to 24mm in a standard
Taping cycle time : 0.3sec./chip : UPH12,000 (Optimum condition)
Automatic recovery function for no-good chips
Wafer mapping data function (option)