Eutectic Die Bonder : Hitachi High-Tech Instruments Co., Ltd.

This high-performance dual heads die bonder conducts solder preforming and thermal compression bonding in the reducing gas atmosphere on the heat sinks which are supplied from parts feeder.(SHD-100/200) After die bonding, the heat sinks are transferred to the carrier and housed in the magazines.
SHD-300 is eutectic die bonder for lead frame.

Features

High productivity

	Bonding tact time (under optimum conditions) SHD-100 : 1.5 sec./pcs SHD-200 : 1.2 sec./pcs
	Bonding of two kinds of chips onto each heat sink enabled
	Thermal compression bonding of power chips onto each heat sink

Separate transfer system for each heat sink

	Carrier less individual transfer of heat sink
	Heat sink model changing by data
	Glass cover to make transfer area visible

High-quality bonding in the reducing gas atmosphere

	Function for mixing nitrogen and hydrogen gases inside machine
	Achievement of low solder void rate

Flexible solder supply system

	Digital control exercised over amount of wire solder supplied
	Solder supply unit with XY motor-driven stage

Specifications

Model	SHD-200
Dimensions of heat sinks supported	4.5x5.5 to 15x15mm , t=1 to 3mm
Die dimensions	□1.0 to □12.0mm
Bonding tact time	1.2sec./pcs (under optimum conditions)
Preform material supply	Wire solder : Φ0.5 to Φ2.0mm (test is required at over Φ1.2mm)
Die supply	Standard : Max. 8-inch flat ring , Option : Tray
Bonding force setting	0.49N to 1.47N (50g to 150g)
Heating capacity	Collets : Max. 250°C Stage : Max. 400°C
Power supply	3-phase, 200V±10VAC, 50/60Hz Clean air : 0.49Mpa
External dimensions (W x D x H)	2,240x1,430x1,500mm (excluding the parts feeder, light tower and monitor)