*Thing differs from a photograph in part.
This is the epoxy die bonder for multi chip bonding equipped with bonding force control and multi collet change function. It is constructed by the dual bonding heads systems and maximum 8 species of wafer can be mounted on it.
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Features |
High productivity
High quality and High reliability
Superior man-machine interface
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Windows *1 -based user-friendly operation |
| *1 |
Windows is trademark of Microsoft Corporation of the U.S. |
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Specifications |
| Model |
SUX-100 |
| Board dimensions |
35x35 to 160x250mm |
| PCB thickness |
0.5 to 2.0mm |
| Tact time |
0.75 sec./chip (dual heads, under optimum conditions) |
| Number of heads |
Dual heads (1 head / 1 station) |
| Number of installable collets |
6 collets / 1 bonding head
4 collets / 1 pick-up head |
| chip supported (chip dimensions) |
Range for standard specifications : □0.5 to □9mm
Range for all dies supported : □0.5 to □20mm |
| Die packing format supported |
Wafer Standard: 6-inch, 8 models Option: 8-inch
Tray 2-inch, 3-inch |
| Power supply |
3-phase, 200VAC, 50/60Hz
Clean air : 0.39Mpa, Vacuum : -600mmHg |
| External dimensions (W x D x H) |
2,570x1,730x1,565mm (excluding the light tower and monitor) |
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Products |
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