This plasma cleaning system was developed to improve the bonding strength for wire bonding, the bonding strength for flip chip bonding, the filing capability for underfiling, and the adhesiveness for resin searing.
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Features |
The building block system made it possible to change your device from manual one to automatic one.
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Manual Plasma System : SPC-100B
(For experimental research and small lot production) |
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P.C.B. Automatic Transfer System(Magazine-system) : SPC-100H
* After SPC-100B is introduced, SPC-100H can be docked by post-installation. |
Processing time : 12 to 30 seconds/board
High Density and Large Area Processing
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RF power source Max.600w, Processing area of ϑ300mm |
Plasma Processing in Wafer Level Package Process
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Direct processing possible for 8inch wafer (option) |
Multi-product Small-Scale Production to Mass Production
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Two or three kinds of P.C.B.'s can be produced automatically. |
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When the P.C.B. is W75mm or less, three pieces of P.C.B.'s can be processed at the same time. |
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Additionally, when the P.C.B. is L120mm or less, six pieces of P.C.B.'s can be processed at the same time.(option) |
Plasma switching of PE and the RIE form is possible
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Specifications |
| Model |
SPC-100 |
| Substrate dimensions |
Max.130x300mm, 8inch Wafer(option) |
| Electrode |
Parallel planer, PE ⇔ RIE switch |
| RF Power supply |
13.56Mhz, Max.600W, RF auto matching |
| Exhaust system |
Rotary pump 800 l/min |
| Process gas |
Mass flow controller Ar, O2(Additional option:H2) |
External dimensions(WxDxH)
SPC-100B
SPC-100H |
700x750x1,380mm(excluding the light tower and monitor)
1,200x580x1,300mm(excluding the P.C.B. input unit) |
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