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SiP Bonder

DB-800HS
DB-800HS
 
DB-800, 300mm die bonder developed most suitably for SiP assembling.
 

Features
 
High Productivity
20% higher UPH compared to our current model DB-700. (more than UPH10,000)
New vision systems
High resolution vision systems Lighting technology effectively designed for warpage of thin die.
ew operating systems
Newly developed user friendly screen operating systems
 

Thin Die Bonding Technology
 
Realizes thin die pick up by using the ultrasonic pick up and multi-stage pick up.
Realizes high precision paste application by using the non-contact nozzle height control by laser length measurement and mechanical dispenser.
Realizes various thermo-pressure bonding mounting by using the substrate heater/collet heater.
 

Specifications
 
Item Description
Bonding Speed 0.32s/die(Machine cycle time)
Bonding accuracy X,Y : ±15µm
Θ : ±0.5°(3sigma)
Work dimension Lead frame Width : 25-90mm / Length : 100-250mm
Wafer 300mm, 200mm(Optional)
Die 0.8*0.8mm - 25*25mm(Optional)
Dimensions (W)1,900*(D)1,430*(H)1,600[mm]
Weight About 1,600kg
 
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