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SiP Mounter

CM-700X
CM-700X
 
High precision and high speed mounter for CSP/LOC assembly with 300mm wafer handling capabilities.
 

Features
 
Applicable to 300mm and 200mm wafers.
Applicable to µBGA/BOC assembly for the next-generation DRAM package.
Flexible die mount mode selections are appropriate for various packages.
"µBGA" is a registered trademark of Tessera, Inc.
 

Specifications
 
Item Description
Bonding Speed BOC/LOC : 1.0s/di
µBGA/CSP : 1.9s/die
Depends on bonding condition.
Bonding accuracy BOC/LOC : X,Y ħ38µm (3sigma)
µBGA/CSP : X,Y ħ8µm (3sigma)
Work dimension Lead frame Width : 25-90mm/Length : 145-250mm
Wafer 300mm, 200mm (Option)
Die 3*3mm-25*25mm
Dimensions (W)2,370*(D)1,420*(H)1,720[mm]
Weight 2,500kg
 
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