*Thing differs from a photograph in part.
This machine picks up the diced chips from the wafer flat ring. It then positions them by recognition camera, and inserts them into the paper tape. And after sealing cover tape, it winds them around the reel.
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Features |
High productivity
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Direct taping from wafer flat ring |
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High-speed taping with 4 rotary heads mechanism |
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Automatic wafer changer is equipped |
High reliability
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Loading of the bar code reader for map data reading |
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Performing the existence check of a chip twice immediately after the chip insertion and before the seal |
High accuracy taping
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High accuracy taping by positioning with 4 cameras image recognition |
Control system
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The operating system is real-time extended Windows NT*1 and provide the useful operationality |
| *1 |
Windows NT is trademark of Microsoft Corporation of the U.S. |
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Specifications |
| Model |
STP-150 |
| Applicable tape |
8mm paper tape |
| Cycle time |
0.5 to 0.7 sec./chip |
| Chip dimensions |
0.7x0.7mm to 3.0x3.0mm, t=0.5 to 1.0mm |
| Wafer size |
5-inch or 6-inch |
| Chip supplying |
Automatic wafer changer |
| Automatic wafer changing |
Change time : approx. 20sec. (magazine containing 25 wafers) |
| Chip positioning system |
Gray-scale recognition |
| Power supply |
200V±20VAC 3-phase, 50/60Hz
Clean air : 0.4Mpa |
| External dimensions (WxDxH) |
1,250 x 865 x 1,500mm (excluding the light tower and monitor) |
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