This machine picks up the diced chips from wafer flat ring. After flipping, it inserts them into 8mm emboss tape up to 24mm, seals with cover tape and winds them around the reel. Chip positioning is performed by recognition camera, the damage for chips is lessened. Also, high-quality and high-reliability taping is possible with chip vision inspection before the taping.
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Features |
High productivity
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Direct taping from wafer flat ring |
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Taping cycle time : 0.3sec./chip |
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Two 8-heads rotary index mechanism |
High quality and High reliability
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High speed and high accuracy image recognition for chip positioning, vision inspection, tape pocket recognition and chip inspection in a pocket |
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Automatic recovery function for no-good chips |
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Wafer mapping data function (option) |
High flexibility
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8mm emboss tape up to 24mm in a standard |
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Automatic wafer changer is equipped |
Control system and Operationality
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The operating system is real-time extended Windows*1 and provide the useful operationality |
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Various application for vision inspection |
Compact and small foot print
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Required floor space : Approx.1,300x1,240mm |
| *1 |
Windows is trademark of Microsoft Corporation of the U.S. |
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Specifications |
| Model |
STP-200 |
| Applicable tape |
8, 12, 16, 24mm emboss tape |
| Cycle time |
0.3 sec./chip (optimum) |
| Chip dimensions |
1.0x1.0 to 6.0x6.0mm or 1.5x1.5 to 8.0x8.0mm
Option: 0.5x0.5 to 3.0x3.0mm or 3.0x3.0 to 18.0x18.0mm |
| Wafer size |
5-inch, 6-inch or 8-inch |
| Chip supplying |
Automatic wafer changer |
| Automatic wafer changing |
Magazine, Change time : approx. 30 seconds |
| Chip positioning system |
Gray-scale pattern matching or Edge detection |
| Power supply |
200V+20V-10VAC 3-phase, 50/60Hz
Clean air : 0.44Mpa |
| External dimensions (WxDxH)) |
1,430 x 1,490 x 1,690mm (excluding the light tower) |
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Products |
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