This machine picks up only the diced good chips from the wafer after recognition inspection by CCD camera, and inserts them into the tape.
And also it has chip flipping function by operation data setting.
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Features |
High productivity
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Supports various size chips by using optical zoom lens |
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2 recognition CCD cameras
for chip pick up
for chip posture alignment (after flip) |
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100 programming datum can be saved in the machine
floppy disk is available for reading and saving |
Compact and small foot print
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External dimensions : approx. W 950mm x D 850mm x H 1,450mm |
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Specifications |
| Model |
STP-50 |
| Applicable tape |
8mm or 12mm , paper tape or emboss tape |
| Cycle time |
2.5 sec./chip or less |
| Chip dimensions |
1.5x1.5mm to 5.0x5.0mm |
| Wafer size |
6-inch or 8-inch |
| Wafer change |
Manual |
| Positioning system |
Image recognition |
| Power supply |
100V±10V
Clean air : 0.49Mpa |
| External dimensions (WxDxH) |
Approx. 950 x 850 x 1,450mm (excluding the monitor) |
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Products |
Inquiry 
