A turret modular mounting system featuring both a high throughput and a high level of area productivity
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Features |
High throughput and high footprint productivity
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A high throughput of 48,000 cph(option:50,000cph), and high footprint productivity of 10,000 cph/m² are achieved. (TCM-X110J)(under optimum operating conditions) |
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Many different production formats and production quantities are flexibly accommodated, making it easy to construct the optimum production line for the tasks at hand. |
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A line capable of a high throughput of 96,000 cph(option:100,000cph) by double connection. |
Dual tape feeder for long-time operation
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Use of the dual tape feeder increases the number of components mounted and improves the operation rate. |
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Dual tape feeder can be used with both paper tapes and embossed tapes. |
Main optional functions
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Component library teaching |
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Placement data teaching |
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BGAs and CSPs components support |
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Black lighting (Dedicated lighting for board recognition) |
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Supports ceramic boards |
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Specifications |
| Model |
TCM-X110J/TCM-X110M/TCM-X300S |
| Board dimensions (mm) |
50x50~330x250 t=0.5~5.0(TCM-X110J) 50x50~330x250 t=0.5~5.0(TCM-X110M) 50x50~560x460 t=0.5~5.0(TCM-X300S) Boards with up to 610x460mm are transferable. |
| Component package |
8mm(paper), 8~44mm(emboss), Bulk |
| Number of feeders(8mm tape) |
60(30x2) (TCM-X110J) 120(30x4) (TCM-X110M) 72(36x2) (TCM-X300S) |
| Power supply |
Three-phase, 200V±20V, 50/60Hz Approx. 14kVA |
| Air supply(MPa) |
0.45~0.69 , Dry clean air |
| Max. placement speed in optimum(sec./component) |
0.075 (option 0.072) |
External dimensions(mm) (W x D x H) (height of tower light) |
2,400x1,953x1,695 (2,100)(TCM-X110J) 4,500x1,953x1,695 (2,100)(TCM-X110M) 3,130x2,223x1,695 (2,100)(TCM-X300S) |
| Mass (kg) |
Approx. 3,400(TCM-X110J) Approx. 3,950(TCM-X110M) Approx. 4,000(TCM-X300S) |
| Options |
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Placement data teaching |
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Component library teaching |
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Bar code reel check |
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Bar code program change |
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BGA, CSP applicable |
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Dedicated black lighting for board recognition |
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